Molecular bonding technology has the following advantages over the conventional plating technology by roughening

Benefits we can provide


No roughening process required


Reduced use of palladium catalyst


Reduction of transmission loss


Easy to form high-definition wiring


Shortening of the process


Cost reduction

Direct plating using molecular bonding technology

Using molecular bonding technology, direct plating on various resins and inorganic materials is possible.

Direct Plating using Molecular Bonding Technology

Applied Technology

Flexible printed circuits Fiber plating Decorative plating

Application to Flexible printed circuits

In the conventional wiring formation, the anchor effect, which makes the interface between the plating and the substrate rough, is used to obtain adhesion of the plating. However, wiring using the anchor effect has the problem of large transmission loss in high frequency signal transmission.
In the wiring formation using molecular bonding technology, it is possible to apply plating on a smooth surface, which reduces the transmission loss in high frequency signal transmission.

Value provided

Easy high-definition wiring pattern formation

Reduction of high-frequency transmission loss by smoothing circuit

Process and material reduction, yield improvement

30% thinner and lighter than conventional products

Ensuring reliability through strong adhesion

Graph showing the degree of transmission loss

Flexible printed circuits using molecular bonding improve transmission loss.

Conventional wiring formation

Wiring formation for molecular junctions

6th Monozukuri Nihon Grand Award, Minister of Economy, Trade and Industry Prize

The "6th Monozukuri Nihon Grand Award, Minister of Economy, Trade and Industry Prize" was awarded for "Development and Mass Production of Innovative Flexible Printed Circuits with Molecular Level Bonding".

Some of the adapted products are as follows

Camera module

TransferJet™️ dongle

High Frequency Antenna Coupler

Application to fiber plating

In general plating, a process called etching is required to make the surface roughness.
However, it is difficult to apply roughness to finely shaped objects such as fibers, and it has been difficult to obtain strong adhesion by plating on fibers.
In contrast, molecular bonding technology enables direct plating formation on fibers through chemical bonding.

Value provided

Biometric sensing


Antibacterial and deodorant

Surface heating element

Design of accessories, etc.

Plating on PET fibers

Features of fiber plating

Antibacterial and deodorant


Application to decorative plating

Decorative plating ensures a luxurious metallic color tone and durability by applying plating on resin.
Conventional decorative plating processes use hexavalent chromium, which has a large environmental impact, to form roughness on the resin.
Molecular bonding technology is characterized by its ability to plate on a smooth surface, which is hexavalent chromium-free and has a small environmental impact.

Decorative plating of water supply parts made of ABS resin


If you have any questions or concerns about our services or technology,
please feel free to contact us.

Contact us by E-mail

+81-19-601-2610Weekday 9:00~17:30 in Japan