Examples of molecular bonding agent and photoreactive
molecular bonding agent are presented here.
This bonding technology is suitable for highfrequency
substrates required in ICT market.
This can be applied to low dielectric resin such
as LCP, PPE and so on.
※Copper foil Rz 0.85μm LCP Rz 0.75μm
Heat test condition : 260 degree C, 15 seconds, 5 cycle
The interfacial thermal resistances listed were measured by our system, TRMS-1904. TRMS-1904 can reduce the interfacial thermal resistance between the system and the sample, enabling highly accurate measurement of thermal conductivity and interfacial thermal resistance of stacked samples. (JP Patent No. 6923885)
Total thermal resistance is calculated from the difference of temperature between the top and bottom surfaces of the sample when constant heat is flowing. (Steady-state method)
Total thermal resistance: Rtotal ＝ Rc1 ＋ Rb ＋ Rc2 ＝ ΔT／Q
If the interfacial thermal resistance is not negligible, measure the
thermal resistance of samples of different thicknesses and calculate the
interfacial thermal resistance from the y-intercept of the regression line.
Since the thermal conductivity λ of the sample and the total thermal
resistance have the following relationship, λ can be obtained from the
slope of the regression line.
Rtotal ＝ t／(S・λ) ＋ Rc1 ＋ Rc2
※The data in the application examples are measured values, not guaranteed values.
If you have any questions or concerns about our services or technology,
please feel free to contact us.
